Asia Tech Wire (Jan 29) -- Taiwan-based panel maker Innolux Corp. reportedly won orders for power supply ICs from IDM giants NXP Semiconductors N.V. (NXP) and STMicroelectronics N.V. (ST).

Market rumours have spread that Innolux has now entered into cooperation with NXP and ST, and expected to trial production and gradually release production capacity in the second half of this year, Taiwan-based media Commercial Times reported on Monday.

The report pointed out that Innolux will start with Power IC products, which is different from the traditional professional packaging and testing foundry.

In response, an Innolux representative said it does not comment on market rumours or customers.

The panel maker has been seeking transformation for seven years, investing more than NT$2 billion, and has finally taken the first step in transforming into a semiconductor packaging company.

Innolux has built a fan-out panel level package (FOPLP) production line, with a small production capacity of about 15,000 pieces at the first phase, targeting Power IC products.

With customer orders in hand, Innolux has begun planning for the second phase of the investment plan, and co-operation with strategic partners to sell glass backplanes to carrier board manufacturers.