Asia Tech Wire (Nov 4) -- SK hynix unveiled the industry's first 48GB 16-layer HBM3E chip at the SK AI Summit in Seoul on Monday.

The South Korean chipmaker plans to provide samples of the modified chip to customers in early 2025.

At the end of September this year, SK hynix announced the start of mass production of the world's first 12-layer 36GB HBM3E product.

Kwak Noh-Jung, CEO of SK hynix, said the 16-layer HBM3E chip offers an 18% increase in training performance and a 32% increase in inference performance compared to the 12-layer HBM3E chip.