With the gradual implementation of reserve requirement ratio cuts and interest rate cuts, the bond market has ushered in a good issuance window. Since the beginning of this year, the pace of bond issuance by domestic technology giants has quietly accelerated. On May 6, the sixth ultra-short-term financing bill issued by Huawei Investment Holding Co., Ltd. (hereinafter referred to as "Huawei Holding") was listed and circulated. At the same time, the reporter learned from the Shanghai Stock Exchange that the recent 20 billion yuan corporate bond project of Xiaomi Communication Technology Co., Ltd. (hereinafter referred to as "Xiaomi Communication") has been registered and effective, and the issuance work is about to begin. In addition, companies such as ZTE, iFlytek, and BOE are exploring the issuance of bonds for financing. Market insiders said that this year's financing of domestic technology companies will show a diversified trend. On the one hand, against the background of the rapid rise of industries such as AI and automotive electronics, in order to achieve technological iteration and breakthroughs, the R&D investment intensity and capital expenditure scale of domestic technology companies will show an upward trend, and they are willing to expand financing channels; on the other hand, this year's credit bond issuance interest rate level is at a historical low, which is conducive to bond financing.