On May 9, the launch and centralized roadshow of science and technology innovation bonds, hosted by the National Association of Financial Market Institutional Investors and organized by the Beijing Financial Assets Exchange, was held in Beijing, marking the official launch of science and technology innovation bonds in the interbank bond market. During the event that day, many technology-based enterprises and equity investment institutions such as New Hope, Shandong Hongqiao, Xike Holdings, Yizhuang State Investment, BOE, Oriza Holdings, Oriental Fortune, and TEDA Technology Investment conducted centralized roadshows on site. The interbank bond market and the exchange bond market have their own different rules for issuing science and technology innovation bonds. Among them, the science and technology innovation bonds in the interbank bond market were announced by the National Association of Financial Market Institutional Investors on May 7. According to the National Association of Financial Market Institutional Investors, as of May 8, 36 companies have announced the issuance of science and technology innovation bonds, with a total issuance scale of 21 billion yuan; 14 companies have carried out registration applications, with a total registration scale of 18 billion yuan.