The Shenzhen Embodied Intelligent Robot Technology Innovation and Industrial Development Action Plan (2025-2027) was issued. It mentioned that key core technology research and development of embodied intelligent robots, such as core components, AI chips, bionic dexterous hands, bases and large vertical field models, and body control, will be supported, and major science and technology projects will be organized and implemented in stages and batches in the form of unveiling, project manager system, and owner system. Among them, core components research and development will be carried out. Research on high-energy-density micro-motors and drive technologies, and develop high-precision micro-integrated joint modules. Research on six-dimensional force, electronic skin, and multi-dimensional tactile perception technology, and develop high-precision multi-modal sensors such as vision, touch, and force. Develop high-performance, highly integrated brain-like visual sensors. Develop high-energy-density, lightweight batteries.