Asia Tech Wire (Sep 4) -- Hon Hai Chairman Young Liu said that the company is evaluating the establishment of chip packaging and testing plant in Europe, putting advanced packaging technology in the local development.

Liu said that the investment plan is in the stage of continuous negotiation.

He also revealed that Hon Hai's plant in Qingdao, a coastal city in northern China, is currently working on advanced packaging, mainly making small chips or chiplets.

Liu described the factory's progress as good, and expects to continue research and development of packaging and testing technology in the future, and put it on the European market.

He also pointed out that it is unlikely that any European plant that the company may set up in the future will only make chips and not engage in packaging and testing.

In terms of chip design, Liu said that the chip design service of Socle Technology, a subsidiary of Hon Hai, has entered the 5-nanometer stage and has made good progress.

In addition to strengthening automotive electronics, the group is also planning to develop chips for satellite applications, he added.

Liu also said that Hon Hai is also continuing to develop silicon photonics (SiPh) and co-packaged optics (CPO) technology.