TSMC is rushing to develop CoWoS advanced packaging. The latest news is that it will build two new CoWoS plants in the third phase of the Southern Taiwan Science Park, with an estimated investment of more than NT$200 billion. Regarding the related rumors, the Southern Taiwan Science Park Administration said that TSMC did apply for land lease, but it was inconvenient to disclose the manufacturer's development plan. As for TSMC, Chairman Wei Zhejia clearly released the message of "continuous expansion of CoWoS production capacity" at the legal conference last week. The industry believes that TSMC has once again invested heavily in building a new CoWoS plant, revealing that high-performance computing (HPC) related orders from major customers such as Nvidia are more prosperous than expected.