TSMC plans to mass produce panel-level advanced chip packaging in 2027

2025-04-15 13:43:35

TSMC is about to complete the research and development of panel-level advanced chip packaging (PLP) and plans to start small-scale production around 2027. To meet the demand for more powerful artificial intelligence chips, panel-level advanced chip packaging will use square substrates that can accommodate more semiconductors instead of traditional round substrates.

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