Ming-Chi Kuo: AMD may become the first customer to adopt TSMC's advanced packaging technology COUPE
2025-01-23 08:58:31

On January 23, Tianfeng International Securities analyst Ming-Chi Kuo issued a report stating that the latest supply chain survey showed that TSMC’s advanced packaging technology COUPE (Compact Universal Photon Engine) development and supply chain visibility have significantly improved, and Qijing Optoelectronics ( Himax) has been confirmed as the exclusive supplier of the first and second generation COUPE microlens arrays. The first generation of COUPE has been developed and mass production verification has begun. The second generation mass production verification is expected to begin in 1H26. Among TSMC's major customers, AMD may be the first to adopt COUPE.
Email Subscription
Newsletters and emails are now available! Delivered on time, every weekday, to keep you up to date with North American business news.
ASIA TECH WIRE

Grasp technology trends

Download