Asian Tech Press (Dec 13) -- Intel Corp. will invest 30 billion ringgit ($7 billion) to expand its production capacity for advanced semiconductor packaging technology in Penang, Malaysia, according to a press invitation, Bloomberg reported Monday.

The report said that the U.S. chipmaker is scheduled to hold a press conference on Wednesday at the Kuala Lumpur International Airport on the investment.

And Intel CEO Pat Gelsinger, Malaysia's International Trade and Industry Minister Mohamed Azmin Ali and the Malaysian Investment Development Authority (MIDA) CEO Arham Abdul Rahman will attend the conference.

The invitation states that Intel's enhanced capacity in Malaysia for advanced packaging technology will help its support activities and strengthen its status as a global service center.