Asia Tech Wire (Oct 28) -- Intel announced Monday that it is expanding its packaging and testing facility in Chengdu, one of the largest cities in southwest China.

Intel's Chengdu site will add server chip packaging and testing facilities to its existing client product packaging and testing facilities.

The shift comes in direct response to growing demand for energy-efficient server chips in China, particularly in the areas of cloud computing, big data analytics and enterprise applications.

Meanwhile, Intel will also set up a customer solutions center here.

According to local media reports, planning and construction work on this Intel investment has already begun.