Huawei HiSilicon to deliver its first flexible OLED driver chip by the end of 2021

2021-07-19 05:08:00

Huawei HiSilicon's first flexible OLED driver chip has now entered the trial production phase, which is expected to be officially delivered to suppliers by the end of this year.

Huawei HiSilicon's flexible OLED IC adopts a 40nm process and is scheduled for mass production in the first half of next year. Samples have been sent to BOE, Huawei, and Honor for testing.

According to research agency Omdia, South Korean companies accounted for 90% of the cell phone OLED driver chip foundry market in 2020. Samsung holds the most market share of 50%.

OLED driver chip HiSilicon Huawei

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