Micron breaks ground on new HBM advanced packaging plant in Singapore

2025-01-08 11:24:22

Micron Technology broke ground on Wednesday on a high-bandwidth memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country.

The new plant is scheduled to begin operations in 2026 and expand Micron's total advanced packaging capacity from 2027 to meet the demands of AI growth.

Micron's investment in HBM advanced packaging is about US$7 billion (S$9.5 billion), which will initially create about 1,400 jobs and is planned to expand to about 3,000 jobs in the future.

Singapore

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