Former TSMC R&D deputy director Jing-Cheng Lin confirmed via Linkedin that he has left Samsung, as his employment contract with Samsung expired at the end of 2024

He joined Samsung two years ago as vice president of advanced packaging for the semiconductor business.

Lin, a semiconductor packaging expert, worked at TSMC from July 1999 to December 2017, spanning 18 and a half years.

After leaving TSMC, he joined U.S. storage company Micron Technology as chief operating officer of technology development, which he left in August 2019.

Lin then served as CEO of Skytech, a Taiwan-based semiconductor equipment company, where he gained experience in packaging equipment production.

In March 2023, it was rumored that Samsung had hired Lin as vice president of the advanced packaging business team in the semiconductor division (DS), responsible for advanced packaging development.

However, after only two years of service, the news of his departure came out on the last day of 2024, and Lin confirmed this in Linkedin on the same day.

Last August there was news that Samsung Electronics' advanced packaging business group has been disbanded, and Lin's contract with Samsung was about to expire.