Asian Tech Press (OCT 25) -- According to media reports, in addition to TSMC, Intel, Samsung Electronics and other major manufacturers, UMC Electronics also plans to invest 100 billion NTD (about $3.59 billion) in a new 12-inch wafer fab in Singapore.

UMC's new fab will maintain a monthly capacity of 20,000-30,000 wafers and is expected to use a sub-40nm process to foundry chips for related manufacturers.

This will be the second 12-inch wafer fab built by UMC in Singapore. UMC currently has four 12-inch wafer fabs, of which the 12i factory is located in Singapore.