TSMC, a global leading wafer foundry, plans to move its production capacity, shifting a mature process equipment for 12-inch silicon wafer of 28nm or below, which is capable of producing about 20,000 pieces, from Taiwan to its Nanjing plant in mainland China, doubling the capacity of the Nanjing plant.

TSMC's Nanjing plant has reached its original target to produce 20,000 wafers per month, and the technologies are mainly 12nm and 16nm processes.