Asia Tech Wire (Aug 19) -- TSMC will hold a groundbreaking ceremony for its first 12-inch wafer fab in Europe on Tuesday.

The plant sits in Dresden, Germany, and is due to introduce 28/22nm planar complementary metal-oxide-semiconductor (CMOS) technology, as well as 16/12nm fin field-effect transistor (FinFET) processes, with an initial monthly capacity of about 40,000 wafers.

TSMC has received strong support from the German government for the construction of this plant. Through the European Chips Act, the German government will provide 5 billion euros in subsidies.

In the plant, TSMC holds 70%, Europe's three largest semiconductor companies Bosch, Infineon and NXP each accounted for 10%.

TSMC plans to start operations at the plant by the end of 2027, with an estimated cost of more than 10 billion euros ($10.8 billion).

Thus, TSMC's overseas investments in Germany, Japan and the U.S. totaling nearly $100 billion are in full swing.