Asian Tech Press (Mar. 4) -- TSMC, Intel, Samsung and others announced Thursday the formation of a chiplet alliance, aiming to establish an industry standard for advanced chip-packaging technologies.

The consortium, dubbed Universal Chiplet Interconnect Express (UCIe), aims to establish a die-to-die interconnection standard and promote an open chiplet ecosystem, according to Taiwanese media reports.

Chiplet technology is the integration of multiple small, diced chips into a single advanced package.

Members of the UCIe include 10 major players in the industry, namely, Intel, TSMC, ASE Group, AMD, Qualcomm, Samsung, Arm Ltd., Google Cloud, Meta, Microsoft, covering wafer fabrication, IC design, packaging and testing, cloud, and networking services.