Asian Tech Press (Nov 1) -- Former Micron Taiwan chairman KC Hsu has reportedly returned to TSMC as head of the research and development organization.

TSMC confirmed on Monday that it is honored to hire Hsu to join the Research and Development (R&D) organization as head of the Integrated Interconnect & Packaging (IIP) organization with immediate effect, according to Taiwan's Economic Daily News.

Earlier this year in September, Taiwanese media exclusively reported that Micron Technology, Taiwan's largest foreign company and the world's third-largest memory manufacturer, announced internally that Micron Vice President and Chairman of Micron Taiwan, KC Hsu, had decided to leave Micron.

Last year, market sources indicated that KC Hsu might leave Micron Technology and return to TSMC to lead the construction of a 5nm fab in Arizona, USA.

However, in December 2020 TSMC appointed Rick Cassidy, head of the Corporate Strategy Office, to take charge of the Arizona plant and also serve as CEO and President of subsidiary TSMC Arizona Corporation (TSMC Arizona).

It now appears that although Hsu does not lead the construction of TSMC's Arizona plant, the news of his return to TSMC has come true.

Public information shows that Hsu was the General Manager of TSMC's 8-inch fab WaferTech in the US, and left to join Micron in 2015 and was promoted to Chairman of Micron Taiwan in 2019, and has accumulated more than 30 years of experience in the semiconductor industry.