Asian Tech Press (Mar. 2) -- Taiwan's MediaTek Inc. unveiled on Monday three 5G chips using TSMC's 5nm and 6nm technologies.

It covers the full range of high, medium and low-end 5G chips, including the Dimensity 8100, Dimensity 8000 and Dimensity 1300 system-on-chips (SoCs).

MediaTek said that the Dimensity 8100 and Dimensity 8000 are positioned for high-end 5G handsets, and smartphones featuring these three new chips will be available in the market in the first quarter of 2022.

The Dimensity 8100 and Dimensity 8000 chips are manufactured using TSMC's 5nm process technology, while the Dimensity 1300 is built by TSMC's 6nm process.