Huawei's first wafer fab is located in Wuhan, Hubei Province, China, and is scheduled to go into production in 2022.

Sources close to the media disclosed that the factory is initially planned to produce optical communication chips and modules products to achieve self-sufficiency. According to an article, Huawei's HiSilicon is the only company in China to develop coherent optical DSP chipsets.

At present, companies with advanced chip research and development capabilities and wafer fabs are rare worldwide, well-known companies including Intel, Samsung, SK Hynix, Micron, etc.

Huawei Wuhan research and development force is said to be nearly 10,000 people, and the main projects include optical communication equipment, Hessian chips, self-driving LIDAR, etc.