Softbank: Planned additional capital raising no more than 3.378 billion yuan
2025-05-07 20:15:22

Neusoft announced that it plans to raise no more than 3.378 billion yuan through a private placement to be used for the Beijing-Tianjin-Hebei Softcom Innovation and Manufacturing Base Project, the AIPC Intelligent Manufacturing Base Project, the Neusoft Huailai Intelligent Computing Center (Phase I) construction project, and the computer production workshop intelligent upgrade technology transformation project.
AI
Email Subscription
Newsletters and emails are now available! Delivered on time, every weekday, to keep you up to date with North American business news.
ASIA TECH WIRE

Grasp technology trends

Download